0.6“ Heatspreader

Description

ADL SP0600 (with copper enhancement)

Heatspreader to be attached to a cooling surface. The thermal conduction path is enhanced with copper – to transport the heat from CPU and CHIPSET as fast as possible away from the hot bottom to the cool top surface area.

This is not a standalone thermal solution! All ADL heatspreader must be mounted to a approved or sufficient heatsink.
​To be used with: ADLQM67PC, ADLQM87PC




ADL SP0600 (without copper enhancement)

Heatspreader to be attached to a cooling surface. The thermal conduction path is direct attached – to transport the heat from CPU and CHIPSET as fast as s possible away from the hot bottom to the cool top surface area.

For low power chips there is no need for copper core enhancements. This keeps the thermal solution cheap and lightweight. This is not a standalone thermal solution! All ADL heatspreader must be mounted to a approved or sufficient heatsink.
To be used with: ADLLX8PC, ADL855PC, ADL945PC, ADLGS45PC ADLD25PC, ADLN2000PC, ADLE3800PC